Manufacturing Services

PTS provides Contract design and Manufacturing Services of PCB and Electronics products to Industrial, Military & Commercial customers. With its In-house engineering resources PTS also provides Design & Development services to help realize end-to-end customer needs.

1. Production line
PTS has state-of-the-art Computer aided production machineries & tools for catering to Single Layer & Multilayer PCB manufacturing requirements for different applications. 40 Sq.Mtrs. is the production capacity of the line with upto 26 layers of Multi-layer production. The production line is staffed with qualified technicians trained to handle machineries and processes to produce high quality PCB and products. Following are some of the facilities:

Etching & Developing Plating Through Hole ISOCAM GERBER TOOL ISOLATOR

Drilling/Routing CNC machines with ATC Dry Film Laminators Exposing Image/Photo plotting

2. Assembly line
Assembly line is equipped with automatic and manual placement and soldering of electronic components in each board. Facilities in Assembly line are
• Pick & Place Units
• Dual wave automatic soldering units

1. Rigid laminates
2. Flexible laminates and overlays
3. HF laminates (Teflon)

1. Rigid Laminates
• FR4 epoxy laminate TG 135 FR4 is the standard base material for PCB production. The TG is between 110 and 140 °C.
• HTG epoxy laminate TG 180 Laminates on epoxy resin basis are used with mixed resins like triazine resin in order to increase the TG. HTG epoxy laminates are available with a TG between 145 and 180 °C.
• Cyanate ester laminate TG 250 High performance laminates are required for higher operation temperatures. Cyanate ester laminates shows a better expansion reaction in x and y and are a very good alternative to polyimide laminates. A disadvantage is the higher moisture absorption.
• Polyimide laminate TG 220 High performance laminates for requirements with high responsibility or high operation temperatures. This laminate is preferably used in military aerospace. The disadvantages are the slightly brittle resin, a higher moisture absorption and the slightly lower adhesion strength of the copper foil.
• Aramid laminate TG 180-220 The core material is an unwoven aramid fibre. Very little x-y expansion reaction, relative easy and good laser drillability. Disadvantage is the high z-axis expansion. Our rigid laminates are in accordance with the IPC-4101 class B/L.
2. Flexible laminates and coverlays Polyester films (low cost electronic) or polyimide films (trade name kapton) are used as flexible cores. We use exclusively polyimide films, as this has a much higher solder bath resistance and therefore can be used for nearly all electronic applications. We use two different groups of
• flexible laminates: Laminates with acrylic adhesive coating (LF) To laminate (clad) copper onto the flexible core the manufacturer uses a 25 µm thick acrylic adhesive. This material does not meet the reqirements of UL 94-V0. In addition acrylic adhesive has a very high z-axis expansion which can cause barrel cracking in case of thermal stress.
• Adhesiveless laminates (AP) To laminate copper onto the flexible core the manufacturer uses anchor polyimides. These laminates are free of disturbing adhesive coating. The advantage of adhesiveless laminates can only be used if no cover foil is used within the through-hole platings (window technology).
• Coverlays(LF,FR) A coverlay is a composite material of a Kapton polyimide film covered on one side with acrylic adhesive. The FR type coverlay has a flame retardant acrylic adhesive, making it UL 94-V0 compliant. In this case FR coverlays should be used with adhesiveless laminates (AP).
3. HF laminates (Teflon) Among the high frequency laminates you find pure PTFE (teflon) glass laminates and compositions of teflon, ceramics, and modified resin systems. HF laminates are very different in processing, electrical features, and price (factor 1 to 20). Typical applications are eg. radar systems, cellular phone network, or microwave transmission systems.PTFE substrates (thermoplastics like eg. teflon) are the most used materials in microwave technology. The classical RT/duroid qualities by Rogers belong to this group. The range is completed by the thermosetting TMM® substrates which combine the mechanical strength of ceramics (low coefficient of expansion) and good dielectric results. For mass applications in the low cost area (cellular phone network, communication and sensor technology) the obvious materials are the new RO3000 substrates on PTFE basis as well as the more rigid RO4000 qualities on polymer basis. The RO4000 substrates (thermosetting plastic) can be processed as cost effective as FR4, even as multilayer.Depending on frequency area (500 MHz - 100 GHz) and application the user chooses a base material with an exactly defined relative dielectric constant keeping the loss factor as low as possible.

Lacquer


Application	Method	Colour
Legend print	Screen printing	White ,Yellow, Black
Solder mask	Screen printing	Green, Blue, Black


Finish


The contact of the PCB has to be protected with a good finish. This finishing is used as support of the different soldering and contact processes as well as for protection of bare copper against oxidation. The choice of the right surface depends on the technical requirements (eg. bonding), the design (eg. pitch), and the operating field (eg. thermal shock).

Finish Typical thickness Application Electroless nickel / gold 0.1 µm Au, 3 - 6 µm Ni soldering, bonding, finepitch Eectroless tin 0.8 - 1.2 µm Sn soldering, finepitch HAL (Hot Air Levelling) 1 - 8 µm Pb/Sn soldering, multiple soldering tin lead reflow 8 µm Pb/Sn soldering, multiple soldering

QA department concerned with all quality –related activities such as quality planning, quality control, quality audit and reliability issues A quality assurance programme designed by PTS executes as following

• Incoming material control: All incoming raw materials are sampled and inspected for compliance with drawings, specifications and other conditions of procurement contract.The inspection may involve the use of specialized equipment, chemical analysis and tests within the organization or in an outside test laboratory.


• In Process control: This involves the identification of critical inspection points in the production flow and the material inspected by random sampling. This enables one to take remedial action in case the processes goes out of specifications or control. It also helps to isolate non-salvageable rejects and they are removed from further processing. Examples of such inspections are the measurement of plating thickness and conducting the plating adhesion test. Similarly ,each board is tested for its electrical functions and for shorts, circuit continuity and circuit verifications. For proper process control, production and inspection, equipment and tools also need to be checked periodically to maintenance of proper documentation on the parameters.


• Complete Product Control:The final check is made on at least one board from each 300 completely packaged boards, to check completeness of packaging, identification and overall quality, including the functional electrical test


• Quality control methods
  
  • Physical inspection.
  • Optical inspection.
  • Electrical inspection


• Environmental inspection
  
  • Thermal stress
  • Thermal shock
  • Moisture and Insulation Resistance


• Environmental inspection
  Testing is usually carried out at the following three levels
  • Bare Board Testing;
  • In-circuit Testing
  • Functional Testing


• Automatic Board Testing
  
  • Bed of Nails Method
  • Two Probe or Flying Probe Method


• Pollution control in PCB Factory
  
  • Recycling of Water
  • Filtration
  • Ion Exchange System
  • Reverse Osmosis


• Safety Precautions for the Personnel
  
  • Personal safely is accorded highest priority
  • Operators use all protective devices such as goggles, face mask, gas mask, gloves..etc
  • No smoking and eating is advised in the area where these chemicals are kept.
  • Factory outfit with complete first aid bag.